The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2005
Filed:
Nov. 21, 2003
Yue-ying Jian, Nantou, TW;
Wen-sheng Wu, Hsinchu, TW;
Jien-ren Chen, Miaoli, TW;
Wei-jen Huang, Taoyuan, TW;
Yue-Ying Jian, Nantou, TW;
Wen-Sheng Wu, Hsinchu, TW;
Jien-Ren Chen, Miaoli, TW;
Wei-Jen Huang, Taoyuan, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
An apparatus for shear testing bonds on 8″ and 12″ silicon substrates. The apparatus includes a removable platform for securing the 8″ wafer and a vacuum chuck for securing a 12″ wafer and the removable platform at the same time. A control module controls a moving mechanism to shift a probe to contact the solder ball of the 12″ substrate secured on the vacuum chuck or the solder ball of the 8″ wafer on the removable platform when the removable platform is fixed on the vacuum chuck. The moving mechanism moves the probe in a direction to separate the solder ball from the wafer. A sensor measures the pulling force exerted on the probe when the probe is moved in a direction and separates the solder ball from the wafer.