Company Filing History:
Years Active: 2014-2018
Title: Innovations of Inventor Yuan Zang
Introduction
Yuan Zang is a notable inventor based in Tianjin, China. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving the efficiency and reliability of semiconductor devices.
Latest Patents
One of Yuan Zang's latest patents is titled "Lead frame with dummy leads for burr mitigation during encapsulation." This invention provides a lead frame for a packaged semiconductor device, which includes a die pad and a first row of active lead fingers that are laterally separated. The design aims to mitigate burrs during the encapsulation process, enhancing the overall quality of the semiconductor device. Another significant patent is "Substrate interconnections for packaged semiconductor device." This patent describes a 'universal' substrate made of non-conductive material, featuring a uniform array of conductive pillars that connect various components of the semiconductor device.
Career Highlights
Yuan Zang has worked with prominent companies in the semiconductor industry, including NXP USA, Inc. and Freescale Semiconductor, Inc. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.
Collaborations
Throughout his career, Yuan Zang has collaborated with talented individuals such as Zhigang Bai and Jinzhong Yao. These collaborations have likely fostered a creative environment that has led to innovative solutions in the semiconductor field.
Conclusion
Yuan Zang's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future innovations.