Nxp Usa, Inc.

Freescale Semiconductor,inc.

Yuan Zang

Jinzhong Yao

Zhigang Bai

Chee Seng Foong

Lan Chu Tan

Navas Khan Oratti Kalandar

Kai Yun Yow

Xingshou Pang

Bihua He

Embodiments of a lead frame for a packaged semiconductor device are provided, one embodiment including: a die pad; a first row of active lead fingers that are laterally separated from one another along their entire length; a package body perimeter that indicates placement of a package body of the packaged semiconductor device, wherein the package body perimeter is located laterally around the die pad; a first dummy lead finger positioned in parallel next to an initial active lead finger of the first row of active lead fingers, wherein the first dummy lead finger and the initial active lead finger are laterally separated from one another along their entire length, and wherein the first dummy lead finger is separated from the package body perimeter by a gap distance; and a first tie bar connected to an outside edge of the first dummy lead finger.

Lead frame with dummy leads for burr mitigation during encapsulation

A 'universal' substrate for a semiconductor device is formed of a non-conductive substrate material. A uniform array of conductive pillars is formed in the substrate material. The pillars extend from a top surface of the substrate material to a bottom surface of the substrate material. A die flag may be formed on the top surface of the substrate material. Pillars underneath the die flag are connected to pillars beyond a perimeter of the die flag with wires. Power and ground rings may be formed by connecting rows of pillars that surround the die flag.

Substrate interconnections for packaged semiconductor device

A lead frame based semiconductor die package includes a lead frame having a die pad that supports a semiconductor die and lead fingers that surround the die and die pad. The die is electrically connected to the lead fingers with bond wires. The die and bond wires are covered with an encapsulant with ends of the lead fingers projecting out from the encapsulant. One set of the lead fingers are bent and project down and another set of the lead fingers are bent and project inwardly, and under a bottom surface of the encapsulant. The encapsulant includes a slot or groove for receiving the lead fingers of the second set.

Lead frame based semiconductor die package

Growing community of inventors

Tianjin, China

Yuan Zang