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For the Inventor, By the Inventor

Hsinchu, Taiwan

Yu-Wei Chen

USPTO Granted Patents = 9 

Average Co-Inventor Count = 6.3

ph-index = 2

Forward Citations = 15(Granted Patents)


Company Filing History:

goldMedal9 out of 40,850 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2020-2024

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9 patents (USPTO):Explore Patents
1. 12125868 - Image sensors with dummy pixel structures (2024-10-22),
2. 12080617 - Underfill structure for semiconductor packages and methods of forming the same (2024-09-03),
3. 11842936 - Underfill structure for semiconductor packages and methods of forming the same (2023-12-12),
4. 11626444 - Image sensors with dummy pixel structures (2023-04-11),
5. 11621205 - Underfill structure for semiconductor packages and methods of forming the same (2023-04-04),
6. 11075133 - Underfill structure for semiconductor packages and methods of forming the same (2021-07-27),
7. 11024616 - Package structure and method of manufacturing the same (2021-06-01),
8. 10985125 - Chip package structure (2021-04-20),
9. 10790254 - Chip package structure (2020-09-29),

Title: Yu-Wei Chen: Innovator from Hsinchu

Introduction: Yu-Wei Chen is a renowned inventor hailing from Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Yu-Wei Chen holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and innovative spirit.

Career Highlights: With a career spanning over two decades, Yu-Wei Chen has worked with leading tech companies and research institutions, playing a pivotal role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Yu-Wei Chen has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing that has led to numerous breakthrough inventions.

Conclusion: Yu-Wei Chen's passion for innovation, coupled with his technical acumen and collaborative approach, continues to inspire the next generation of inventors and shape the future of technology.

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