Company Filing History:
Years Active: 2016-2021
Title: Innovations of Yu-Tseng Hsien
Introduction
Yu-Tseng Hsien is a notable inventor based in Tongxiao, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in electromigration sign-off tools. With a total of six patents to his name, Hsien's work is recognized for its impact on integrated chip design and reliability.
Latest Patents
One of Hsien's latest patents is an electromigration sign-off tool that relates to a method of performing electromigration sign-off. This method includes determining a change in temperature due to joule heating from an RMS current of a first interconnect. The change in temperature due to joule heating is added to a change in temperature due to device self-heating to determine a first change in real temperature. A first average current limit is determined for the first interconnect using the first change in real temperature. A first average current on the first interconnect is compared to the first average current limit to determine if a first electromigration violation is present on the first interconnect. Additionally, a second average current is determined for a second interconnect using a second change in real temperature, and this is compared to a second average current limit to check for violations.
Another significant patent by Hsien involves an electromigration sign-off tool that includes electronic memory configured to store an integrated chip design and an environmental temperature corresponding to multiple interconnect wires within the design. An adder is used to add the environmental temperature to a plurality of real temperatures to determine actual temperatures for different interconnect wires. This tool also features an average current limit calculation element and a comparator to assess electromigration violations.
Career Highlights
Hsien is currently employed at Taiwan Semiconductor Manufacturing Company Ltd., where he continues to innovate in semiconductor technology. His work has been instrumental in enhancing the reliability and performance of integrated circuits.
Collaborations
Hsien has collaborated with notable colleagues, including Chin-Shen Lin and Ching-Shun Yang, contributing to advancements in their field.
Conclusion
Yu-Tseng Hsien's contributions to semiconductor technology, particularly through his patents on electromigration sign-off tools, highlight his role as a leading inventor in the industry. His work continues to influence the design and reliability of integrated circuits.
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