Hsinchu, Taiwan

Yu-Syuan Cai

This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2024-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Syuan Cai. Retrieved from https://idiyas.com/inventor/yu-syuan-cai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 66.7

Average Co-Inventor Count = 8.2

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2024-2026

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3 patents (USPTO):Explore Patents

Title: The Innovative Journey of Inventor Yu-Syuan Cai

Introduction: Yu-Syuan Cai, a talented inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Yu-Syuan Cai holds several patents in the areas of semiconductor technology and renewable energy solutions, showcasing his commitment to pushing the boundaries of what is possible in these industries.

Career Highlights: Throughout his illustrious career, Yu-Syuan Cai has worked with leading tech companies and research institutions, honing his skills and expertise in developing cutting-edge technologies that have the potential to shape the future.

Collaborations: Yu-Syuan Cai has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and creativity that has led to the successful development of revolutionary products and solutions.

Conclusion: In conclusion, Yu-Syuan Cai's passion for innovation and his relentless pursuit of excellence have established him as a prominent figure in the world of technology, with his inventions poised to make a lasting impact on society.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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