Yu-Shan Chiu

Title: Innovations by Yu-Shan Chiu

Introduction

Yu-Shan Chiu is a prominent inventor based in Taipei, Taiwan. She has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. Her work focuses on enhancing the efficiency and functionality of semiconductor structures.

Latest Patents

Yu-Shan Chiu's latest patents include innovative designs that address critical challenges in semiconductor manufacturing. One of her patents, titled "Through-silicon via with a non-continuous dielectric layer," describes a through-silicon via (TSV) that features an insulation layer lining the sidewall of a recessed via. This design incorporates a barrier layer and a non-continuous seed layer, enhancing the performance of the TSV. Another notable patent is "Semiconductor structure and method for making the same," which outlines a method for forming a semiconductor structure by utilizing selective atomic layer deposition (ALD) to create a conformal metal layer on a conductor pattern.

Career Highlights

Yu-Shan Chiu is currently employed at Nan Ya Technology Corporation, where she continues to innovate in semiconductor technology. Her work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.

Collaborations

Throughout her career, Yu-Shan has collaborated with talented individuals such as Kuo-Hui Su and Chiang-Hung Lin. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Yu-Shan Chiu's contributions to semiconductor technology through her patents and collaborations highlight her role as a leading inventor in her field. Her innovative approaches continue to shape the future of semiconductor manufacturing.