This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Winbond Electronics Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yu-PO Wang and Semiconductor Patterning Innovation.
Introduction
Yu-PO Wang is an inventor associated with Kaohsiung City, Taiwan, and Winbond Electronics Corporation. His work includes a patented method for forming semiconductor structures.
Latest Patents
Wang’s patent, “Method for Forming Semiconductor Structures,” describes a multi-step process for creating and extending openings in semiconductor layers. The method forms and trims a patterned photoresist layer, transfers patterns between layers, and uses two pattern-reversal processes to create an opening that extends to the substrate. Wang is credited with 1 patent.
Career Highlights
Wang’s patent reflects work on semiconductor fabrication techniques, particularly pattern transfer and pattern reversal. He is associated with Winbond Electronics Corporation.
Collaborations
The available information identifies Winbond Electronics Corporation as Wang’s company but does not specify collaborators or co-inventors for the patent.
Conclusion
Yu-PO Wang’s patented method addresses semiconductor structure formation through sequential patterning and pattern-reversal steps, contributing to the fabrication technologies associated with his work at Winbond Electronics Corporation.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile