Chiayi, Taiwan

Yu-Fu Ku

This inventor holds 1 USPTO granted patent. Top assignee: National Taiwan University. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Fu Ku. Retrieved from https://idiyas.com/inventor/yu-fu-ku-e0unx4rj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Innovations of Yu-Fu Ku in Thermal Compensation Technology.

Introduction

Yu-Fu Ku is a notable inventor based in Chiayi, Taiwan. He has made significant contributions to the field of thermal compensation technology. His innovative work has led to the development of a unique apparatus that addresses thermal effects in various applications.

Latest Patents

Yu-Fu Ku holds a patent for an "Apparatus with temperature self-compensation and method thereof." This system is designed to compensate for thermal effects and includes a substrate structure and a microcantilever. The substrate structure features a first piezoresistor that is embedded within it, which has a first piezoresistance that relates to a variable temperature. The microcantilever experiences thermal effects and possesses a second piezoresistance that also relates to the same variable temperature. The compensation for the thermal effect is achieved based on the relationships of the first and second piezoresistances.

Career Highlights

Yu-Fu Ku is affiliated with National Taiwan University, where he continues to engage in research and development. His work is characterized by a focus on innovative solutions that enhance the performance of thermal systems.

Collaborations

Yu-Fu Ku has collaborated with esteemed colleagues such as Yi-Kuang Yen and Shu Kuan. Their joint efforts contribute to advancing research in the field of thermal compensation.

Conclusion

Yu-Fu Ku's contributions to thermal compensation technology exemplify the impact of innovative thinking in engineering. His patent and ongoing research at National Taiwan University highlight the importance of addressing thermal effects in modern applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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