Company Filing History:
Years Active: 2025
Title: **Innovator Profile: Yu-fu Chen**
Introduction
Yu-fu Chen is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, as showcased by his patent focused on innovative package structures. His work exemplifies the intersection of advanced engineering and practical application in the electronics industry.
Latest Patents
Yu-fu Chen holds a patent for a **Package Structure and Method of Fabricating the Same**. This patent describes a package structure consisting of a first redistribution layer, a semiconductor die, and through vias. The first redistribution layer incorporates dielectric layers, as well as first and second conductive patterns. The design includes a core region where the first conductive patterns display a gradient in pattern density, enhancing performance. The semiconductor die is strategically placed on the core region, and the through vias in the peripheral region ensure electrical connectivity, demonstrating a sophisticated approach to semiconductor packaging technology.
Career Highlights
Yu-fu Chen is currently associated with Taiwan Semiconductor Manufacturing Company Limited, a leader in the semiconductor industry. His role at TSMC underscores his commitment to pushing the boundaries of technology and innovation in a rapidly evolving sector. His contributions to semiconductor packaging have likely influenced various applications in consumer electronics, computing, and beyond.
Collaborations
Throughout his career, Yu-fu has collaborated with talented colleagues, including Kris Lipu Chuang and Tzu-Sung Huang. These partnerships have been vital in fostering innovation and developing groundbreaking solutions in semiconductor designs and applications.
Conclusion
As an inventor, Yu-fu Chen has made a remarkable impact on the technology landscape through his patent and collaborative efforts in the field of semiconductor manufacturing. His innovative spirit and dedication to research and development continue to inspire advancements within the industry.