This inventor holds 1 USPTO granted patent. Top assignee: Force-Mos Technology Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yu-Chan Tsai: Multi-Chip Package Device Invention
Introduction
Yu-Chan Tsai is an inventor associated with New Taipei City, Taiwan. His listed patent concerns a method for making a multi-chip package device, and he is associated with Force-Mos Technology Corporation.
Latest Patents
Tsai’s listed patent, “Method of Making a Multi-Chip Package Device,” describes a process for assembling a transistor chip and a circuit control chip on a lead-frame unit. The method electrically connects the chips and covers the transistor chip with a main conducting part, then encapsulates the components while leaving a leg part exposed. The exposed leg is bent to form a planar conducting portion whose bottom surface is coplanar with the base seat’s bottom surface. Tsai is credited with 1 patent.
Career Highlights
The available information connects Tsai’s patent work with Force-Mos Technology Corporation. The invention focuses on chip packaging and electrical connections within a multi-chip device.
Collaborations
Yuan-Shun Chang and Kao-Way Tu are identified as Tsai’s coworkers. The provided information does not specify their roles in the patent or the invention.
Conclusion
Yu-Chan Tsai’s listed invention addresses a multi-chip packaging method that integrates transistor and control chips with a carefully formed planar conducting portion.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile