Method of making a multi-chip package device

Abstract

A method for making a multi-chip package device includes: providing a lead frame unit having a plurality of lead frames, each of the lead frames having a base seat that has an upper surface and a bottom surface, and a plurality of leads; electrically attaching a transistor chip onto the base seat, the transistor chip having a plurality of electrode pads; attaching a circuit control chip to the base seat; covering the transistor chip with a main conducting part, and electrically connecting the main conducting part with at least one of the source electrode pads; electrically connecting the circuit control chip to another source electrode pad; encapsulating the transistor chip and the circuit control chip to expose a leg part; and bending the leg part that is exposed to form a planar conducting portion having a bottom surface coplanar with the bottom surface of the base seat.