This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Mitsubishi Materials Corporation. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014
Title: Yousuke Kawamura: Innovator in Solder Technology
Introduction
Yousuke Kawamura is a notable inventor based in Iwaki, Japan. He has made significant contributions to the field of solder technology, particularly with his innovative patent related to solder powder and solder paste.
Latest Patents
Kawamura holds a patent for a unique solder powder and solder paste that utilizes solder powder with an average particle size of 5 µm or less. This invention features a center core made of an intermetallic compound of silver and tin, or silver combined with the intermetallic compound of silver and tin. The covering layer consists of tin, and an intermediate layer made of an intermetallic compound of copper and tin is interposed between the center core and the covering layer, ensuring that at least part of the center core is covered.
Career Highlights
Yousuke Kawamura is currently employed at Mitsubishi Materials Corporation, where he continues to develop and innovate in the field of materials science. His work has been instrumental in advancing solder technology, which is crucial for various electronic applications.
Collaborations
Kawamura has collaborated with talented coworkers such as Hiroki Muraoka and Sho Nakagawa, contributing to a dynamic team focused on innovation and excellence in their field.
Conclusion
Yousuke Kawamura's contributions to solder technology through his patent demonstrate his commitment to innovation and excellence. His work at Mitsubishi Materials Corporation continues to impact the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile