The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2014
Filed:
Aug. 22, 2012
Sho Nakagawa, Iwaki, JP;
Hiroki Muraoka, Iwaki, JP;
Kanji Kuba, Iwaki, JP;
Yousuke Kawamura, Iwaki, JP;
Sho Nakagawa, Iwaki, JP;
Hiroki Muraoka, Iwaki, JP;
Kanji Kuba, Iwaki, JP;
Yousuke Kawamura, Iwaki, JP;
Mitsubishi Materials Corporation, Tokyo, JP;
Abstract
In solder powder having an average particle size of 5 μm or less and constituted by a center core and a covering layer covering the center core, wherein the center core consists of an intermetallic compound of silver and tin, or silver and the intermetallic compound of silver and tin, the covering layer consists of tin, and an intermediate layer which consists of an intermetallic compound of copper and tin is interposed between the center core and the covering layer so that at least a part of the center core is covered thereby.