Taichung, Taiwan

Youngrae Kim

This inventor holds 1 USPTO granted patent. Top assignee: Micron Technology Incorporated. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Youngrae Kim. Retrieved from https://idiyas.com/inventor/youngrae-kim-z63f2j2h

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Youngrae Kim: Semiconductor Manufacturing Invention

Introduction

Youngrae Kim is an inventor based in Taichung, Taiwan. His patent work is associated with Micron Technology Incorporated and focuses on materials and processes for semiconductor device manufacturing.

Latest Patents

Kim is credited with 1 patent: “Mount Tape Having an Inner Support Layer Between Adhesive Layers for Semiconductor Device Assembly.” The invention describes a mount tape with two adhesive layers designed to release at different stages of semiconductor manufacturing. An inner support layer sits between the adhesive layers and is configured for removal during the process. This arrangement is intended to support tape handling and staged release during device assembly.

Career Highlights

Kim’s listed patent reflects work on manufacturing materials used in semiconductor device assembly. The patent identifies Micron Technology Incorporated as his company.

Collaborations

Kim’s listed coworker is Brandon P. Wirz. The available information does not specify their roles or describe a particular joint project.

Conclusion

Youngrae Kim’s patent addresses mount-tape design for semiconductor manufacturing, with staged adhesive release and a removable inner support layer as its central features.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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