This inventor holds 6 USPTO granted patents and 25 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Youngbae Kim: Innovator in Semiconductor Technology
Introduction
Youngbae Kim is a prominent inventor based in Suwon, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His innovative work has been instrumental in advancing the capabilities of semiconductor packaging.
Latest Patents
Youngbae Kim's latest patents include a semiconductor package and a method of manufacturing the semiconductor package. This semiconductor package features a film substrate with a plurality of wires on its upper surface. An upper insulating film covers these wires, defining pad openings and a mounting region opening. The design allows for effective bonding of a semiconductor chip to the exposed inner lead bonding portion. Another notable patent is for a film package and package module, which includes a film substrate with a device region and a reinforcing region. This film package accommodates an elongated rod-shaped semiconductor chip and interconnection patterns that enhance electrical connectivity.
Career Highlights
Youngbae Kim is currently employed at Samsung Electronics Ltd., a leading company in the technology sector. His work at Samsung has allowed him to push the boundaries of semiconductor technology and contribute to the company's innovative product offerings.
Collaborations
Throughout his career, Youngbae has collaborated with talented coworkers, including Narae Shin and Youngjun Yoon. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Youngbae Kim's contributions to semiconductor technology through his patents and work at Samsung Electronics Ltd. highlight his role as a key innovator in the field. His ongoing efforts continue to shape the future of semiconductor packaging and manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile