The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2026
Filed:
Dec. 12, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Youngbae Kim, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
A semiconductor package includes: a plurality of lower redistribution line patterns, a plurality of lower redistribution via patterns, and a lower redistribution insulating layer surrounding the plurality of lower redistribution line patterns and the plurality of lower redistribution via patterns; an expanded layer at least partially defining a mounting space and including, on the lower redistribution layer, a via pad at least partially defining a via pad recess extending from a bottom surface of the via pad into the via pad, an expanded structure covering the via pad, and an extending via portion connected with the via pad through the expanded structure; and a semiconductor chip in the mounting space, on the lower redistribution layer, wherein, from among the lower redistribution via patterns, a lower redistribution via pattern connected with the via pad extends into the via pad while filling the via pad recess.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile