The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
Jul. 19, 2023
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventor:
Youngbae Kim, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); G01R 31/28 (2006.01); H03K 3/03 (2006.01);
U.S. Cl.
CPC ...
H01L 22/34 (2013.01); G01R 31/2831 (2013.01); G01R 31/2884 (2013.01); H03K 3/0315 (2013.01);
Abstract
Provided is a semiconductor package, including a first semiconductor chip, and a second semiconductor chip on the first semiconductor chip, wherein the first semiconductor chip includes a test pattern, and wherein a frequency based on stress being exerted on the first semiconductor chip is measured based on the test pattern.
Quick Actions:
Kim, Youngbae. (2026). Semiconductor package including test pattern and method of fabricating the same (U.S. Patent No. 12598961). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12598961
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile