Young Woon Jeon

Title: Young Woon Jeon: Innovator in Chip Substrate Technology

Introduction

Young Woon Jeon is a notable inventor based in Ansan-si, South Korea. He has made significant contributions to the field of chip substrate technology, holding two patents that showcase his innovative approach to electronic components.

Latest Patents

His latest patents include a unique chip substrate design that features at least one insulation portion interposed between conductive portions. This design incorporates a cavity formed in a recessed shape from a region of the upper surface of the chip substrate, which exposes a top surface of part of the insulation portion. Additionally, an insulation layer is coated on the upper surface of the chip substrate, excluding the region of the cavity. A bump may be formed at a predetermined height within the cavity. Another patent focuses on a chip substrate that includes laminated conductive portions and laminated insulation portions that electrically isolate the conductive portions. This substrate also features a cavity in a recessed shape on the upper surface, with a continuous plating layer along the periphery of the chip substrate.

Career Highlights

Young Woon Jeon is currently employed at Point Engineering Co., Ltd., where he continues to develop innovative solutions in the field of chip substrates. His work has contributed to advancements in electronic packaging and component design.

Collaborations

He collaborates with talented coworkers, including Ki Myung Nam and Kyoung Ja Yun, who contribute to the innovative environment at Point Engineering Co., Ltd.

Conclusion

Young Woon Jeon's contributions to chip substrate technology reflect his dedication to innovation and excellence in the field. His patents demonstrate a commitment to advancing electronic component design, making him a significant figure in the industry.