Hwaseong-si, South Korea

Young-Hoon Ro


Average Co-Inventor Count = 2.0

ph-index = 5

Forward Citations = 84(Granted Patents)


Location History:

  • Chungcheongnam-do, KR (2003 - 2005)
  • Gyeonggi-do, KR (2009)
  • Hwaseong-si, KR (2010 - 2013)
  • Cheonan-si, KR (2009 - 2016)

Company Filing History:


Years Active: 2003-2016

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8 patents (USPTO):Explore Patents

Title: Young-Hoon Ro: A Pioneer in Semiconductor Technology

Introduction

Young-Hoon Ro, an accomplished inventor based in Hwaseong-si, South Korea, has made significant advancements in the field of semiconductor technology. With a total of eight patents to his name, he has demonstrated a strong command of innovation in printed circuit boards and packaging solutions for semiconductors.

Latest Patents

Two of Young-Hoon Ro’s latest patents showcase his ingenuity and expertise in the area of semiconductor packaging. The first patent, titled "Printed Circuit Board and Semiconductor Package Using the Same," details a semiconductor package that includes a substrate featuring connection pads and mounted semiconductor chips. This innovative structure boasts an underfill layer that fills the space between the chips and the substrate, equipped with solder bumps that facilitate electrical connections. Additionally, the substrate incorporates void-preventing patterns, enhancing the reliability and performance of the semiconductor package.

The second patent, "Package on Package," introduces a unique package-on-package structure that includes a first substrate characterized by a C-shaped edge region. This design allows for two connection pads arranged to face one another, with solder balls placed in the space created by the C-shaped edge. This patent exemplifies Young-Hoon Ro’s creativity in optimizing semiconductor packaging techniques for better performance and efficiency.

Career Highlights

Throughout his career, Young-Hoon Ro has consistently contributed to the advancement of semiconductor technologies. His work at Samsung Electronics Co., Ltd. has placed him at the forefront of innovation in the electronics industry. His insights and developments in packaging technology have been pivotal in enhancing the functionality and scalability of electronic devices.

Collaborations

Young-Hoon Ro has collaborated with talented coworkers including Donghan Kim and Woo-Jae Kim, who share his passion for innovative semiconductor solutions. Together, they have pushed the boundaries of what is possible in the electronics field, achieving remarkable results that address modern technological challenges.

Conclusion

In conclusion, Young-Hoon Ro stands out as a leading inventor in the semiconductor industry. With a robust portfolio of patents and collaborative efforts with esteemed colleagues at Samsung Electronics Co., Ltd., he continues to make significant contributions to the field. His work not only enhances device functionality but also sets the stage for future innovations in semiconductor packaging technology.

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