The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 22, 2016
Filed:
Mar. 05, 2015
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Jik-Ho Song, Seoul, KR;
Ga-Young Kim, Cheonan-si, KR;
Woo-Jae Kim, Hwaseong-si, KR;
Young-Hoon Ro, Cheonan-si, KR;
Abstract
Embodiments of the inventive aspect include a printed circuit board and a semiconductor package using the same. The semiconductor package includes a substrate having one or more connection pads, semiconductor chips mounted on the substrate, an underfill layer filling a region between the semiconductor chips and the substrate, and solder bumps electrically connecting the connection pads and the semiconductor chips in the underfill layer. The substrate includes void preventing patterns protruding on a top surface of the substrate under the underfill layer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile