The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2013
Filed:
Mar. 07, 2011
Woo-jae Kim, Hwaseong-si, KR;
Young-hoon RO, Hwaseong-si, KR;
Sung-woo Park, Anyang-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
A package on package structure is provided. The package on package structure may include a first substrate having a first center region and a first C-shaped edge region at a first end of the first center region. In example embodiments, the first C-shaped edge region may faun a first space. The package structure may further include at least two first connection pads on an inner surface of the first C-shaped edge region and the at least two first connection pads may be arranged to face one another. In example embodiments, at least one first solder ball may be arranged in the first space and the at least one first solder ball may be connected to the at least two first connection pads.