Youn Ji Min

Title: Youn Ji Min: Innovator in Semiconductor Packaging

Introduction

Youn Ji Min is a prominent inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work is instrumental in advancing technology in this critical area.

Latest Patents

Youn Ji Min's latest patents focus on innovative methods of fabricating semiconductor packages. One of his notable inventions includes a semiconductor package that features a redistribution substrate, a semiconductor chip, and an external terminal. The design incorporates a first insulating layer with a first opening and a second insulating layer that includes a second opening, strategically positioned for optimal performance. The package also includes a first barrier metal layer, a first redistribution conductive pattern, and a pad that connects electrically to the conductive pattern. This invention emphasizes surface roughness and the interaction between the barrier metal layer and the chip pad, showcasing Youn Ji Min's expertise in semiconductor technology.

Career Highlights

Youn Ji Min is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His role at Samsung allows him to work on cutting-edge technologies and contribute to the development of advanced semiconductor solutions.

Collaborations

Throughout his career, Youn Ji Min has collaborated with talented coworkers, including Seokhyun Lee and Jongyoun Kim. These collaborations have fostered innovation and enhanced the quality of their projects.

Conclusion

Youn Ji Min is a key figure in the semiconductor packaging industry, with a strong portfolio of patents and a successful career at Samsung Electronics. His contributions continue to shape the future of technology in this field.