Beijing, China

You-Sen Wang

USPTO Granted Patents = 4 

Average Co-Inventor Count = 5.2

ph-index = 4

Forward Citations = 44(Granted Patents)


Company Filing History:


Years Active: 2011-2014

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4 patents (USPTO):Explore Patents

Title: The Innovations of You-Sen Wang: A Spotlight on His Patents and Career

Introduction

You-Sen Wang, an accomplished inventor based in Beijing, China, stands out in the field of thermal interface materials with a total of four patents to his name. His innovative approach and contributions to electronic assembly technologies are noteworthy, showcasing his dedication to advancing materials science and engineering.

Latest Patents

Wang's latest patents demonstrate his expertise in developing thermal interface materials. One significant patent is for a thermal interface material with a patterned carbon nanotube (CNT) array. This patent describes a method that involves providing a substrate with multiple CNT arrays and defined interspaces, where low melting point metallic nanoparticles are utilized. Upon heating, these nanoparticles combine with the CNT arrays, forming a robust composite material.

Another of his key patents outlines an electronic assembly that includes a thermal interface material sandwiched between a heat source and a heat dissipating device. This assembly leverages the unique properties of thermally conductive particles that change in size and melting temperature based on the operating conditions, enhancing heat management for electronics.

Career Highlights

You-Sen Wang has built a remarkable career, notably working with Tsinghua University, one of China's premier institutions, and Hon Hai Precision Industry Co., Ltd., renowned for its contributions to electronics manufacturing. His experience in these esteemed organizations has equipped him with a strong foundation in both academic and industrial research.

Collaborations

Alongside his innovative endeavors, Wang has collaborated with esteemed colleagues such as Yuan Yao and Feng-Wei Dai. These partnerships have fostered an environment for shared ideas and enhanced research outcomes, contributing to advancements in material science and technology.

Conclusion

You-Sen Wang’s contributions to the field of thermal interface materials have positioned him as a key innovator within the electronics industry. With his innovative patents and collaborations, he continues to make significant strides in enhancing the efficiency and performance of electronic assemblies. His work reflects a commitment to innovation and a deep understanding of materials science, promising further developments in the years to come.

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