The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 20, 2011
Filed:
Oct. 14, 2009
You-sen Wang, Beijing, CN;
Yuan Yao, Beijing, CN;
Feng-wei Dai, Beijing, CN;
Ji-cun Wang, Beijing, CN;
Hui-ling Zhang, Beijing, CN;
You-Sen Wang, Beijing, CN;
Yuan Yao, Beijing, CN;
Feng-Wei Dai, Beijing, CN;
Ji-Cun Wang, Beijing, CN;
Hui-Ling Zhang, Beijing, CN;
Tsinghua University, Beijing, CN;
Hon Hai Precision Industry Co., Ltd., Tu-Cheng, New Taipei, TW;
Abstract
An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.