The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2014

Filed:

Oct. 08, 2009
Applicants:

Feng-wei Dai, Beijing, CN;

Yuan Yao, Beijing, CN;

You-sen Wang, Beijing, CN;

Ji-cun Wang, Beijing, CN;

Hui-ling Zhang, Beijing, CN;

Inventors:

Feng-Wei Dai, Beijing, CN;

Yuan Yao, Beijing, CN;

You-Sen Wang, Beijing, CN;

Ji-Cun Wang, Beijing, CN;

Hui-Ling Zhang, Beijing, CN;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 3/00 (2006.01); H01B 1/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for making a thermal interface material includes following steps. A substrate having a plurality of CNT arrays arranged thereon and a number of first interspaces defined between the CNT arrays is provided. A container is provided and the substrate with the CNT arrays is disposed into the container. A number of low melting point metallic nanoparticles is provided and filled in the first interspaces. The low melting point metallic nanoparticles in the container is heated into a liquid state, and the low melting point metal nanoparticles in liquid state is combined with the CNT arrays to form a composite material on the substrate. The composite material is peeled off from the substrate, and a thermal interface material is obtained.


Find Patent Forward Citations

Loading…