Yosuke Koma

Title: Yosuke Koma: Innovator in Pressure Sensitive Adhesives

Introduction

Yosuke Koma is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of pressure sensitive adhesives, holding 2 patents that showcase his innovative approach to adhesive technology.

Latest Patents

Koma's latest patents include a pressure sensitive adhesive sheet and a semiconductor-related-member processing sheet. The pressure sensitive adhesive sheet features a unique composition that allows for a reduction in adhesive strength at desired timings, facilitating easier release of adherends. This innovative mechanism involves an aliphatic polycarbonate and a pressure sensitive adhesive resin, along with an acid/base generator that activates upon energy application. His semiconductor-related-member processing sheet enhances the removability of semiconductor-related members while maintaining the reliability of chips manufactured from these members. This sheet comprises a base material and a pressure sensitive adhesive layer that includes energy ray polymerizable compounds, ensuring effective performance in semiconductor processing.

Career Highlights

Throughout his career, Koma has worked with prominent companies such as Lintec Corporation and Sumitomo Seika Chemicals Co., Ltd. His experience in these organizations has contributed to his expertise in adhesive technologies and semiconductor processing.

Collaborations

Koma has collaborated with notable coworkers, including Yutaka Nanashima and Yoshitomo Ono. These partnerships have likely enriched his work and led to further advancements in his field.

Conclusion

Yosuke Koma's innovative work in pressure sensitive adhesives and semiconductor processing highlights his significant contributions to technology. His patents reflect a commitment to enhancing adhesive performance and reliability in various applications.