Lintec Corporation

Sumitomo Seika Chemicals Co., Ltd.

Yosuke Koma

Kiyoshi Nishioka

Yoshitomo Ono

Takuo Nishida

Shizuka Hachiken

Yutaka Nanashima

Misaki Sakamoto

A pressure sensitive adhesive sheet is provided which comprises a pressure sensitive adhesive layer formed of a pressure sensitive adhesive composition. The pressure sensitive adhesive composition contains an aliphatic polycarbonate and a pressure sensitive adhesive resin other than the aliphatic polycarbonate. The pressure sensitive adhesive sheet can be reduced in the adhesive strength at desired timing by a novel mechanism of action so that the release of an adherend becomes easy. The above pressure sensitive adhesive composition preferably contains an acid/base generator that generates an acid or a base by applying energy.

Pressure sensitive adhesive sheet

As a semiconductor-related-member processing sheet which can stably achieve to enhance the removability of the semiconductor-related-member processing sheet and to suppress the reliability degradation of members comprising chips manufactured from a semiconductor-related member using the semiconductor-related-member processing sheet, there is provided a semiconductor-related-member processing sheet, comprising a base material and a pressure sensitive adhesive layer provided on or above one surface of the base material, wherein the pressure sensitive adhesive layer comprises one or more types of energy ray polymerizable compounds having an energy ray polymerizable functional group, wherein at least one type of the energy ray polymerizable compounds is a polymerizable branched polymer that is a polymer having a branched structure, wherein a contact angle on a measurement target surface is 40&#xb0; or less when measured using a water droplet under an environment of 25&#xb0; C. and a relative humidity of 50%.

Sheet for semiconductor-related-member processing and method of manufacturing chips using the sheet

Growing community of inventors

Tokyo, Japan

Yosuke Koma