Kyoto, Japan

Yosui Futamura

This inventor holds 6 USPTO granted patents and 13 published patent applications. Top assignees: Rohm Co., Ltd., Rohm Gmbh. Active years: 2018-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yosui Futamura. Retrieved from https://idiyas.com/inventor/yosui-futamura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 100.0

Average Co-Inventor Count = 2.1

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018-2026

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6 patents (USPTO):Explore Patents

Title: Yosui Futamura: Innovator in Semiconductor Technology

Introduction

Yosui Futamura is a prominent inventor based in Kyoto, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His innovative designs and solutions have advanced the capabilities of semiconductor devices.

Latest Patents

Futamura's latest patents include a semiconductor package with a lead frame. This invention features a semiconductor device that comprises a first lead, a first semiconductor element mounted on the first lead, and a sealing resin that covers the first semiconductor element. The first lead includes a first die pad, a second die pad, a third die pad, a first connecting portion, and a second connecting portion. The design ensures that the first die pad has a first main surface and a first back surface facing opposite sides in a thickness direction. Additionally, the second die pad is arranged side by side with the first die pad in a first direction orthogonal to the thickness direction.

Another notable patent involves a semiconductor device that includes a semiconductor element with electrodes inserted into recess portions of a conductive member. This device features a conductive member with a main surface facing one side in a thickness direction, and a semiconductor element with multiple pads facing the main surface. The conductive member contains several recessed portions, and the semiconductor device includes a conductive bonding layer arranged in each recessed portion. The electrodes are separately inserted into these recessed portions, ensuring a robust connection.

Career Highlights

Yosui Futamura is currently employed at Rohm Co., Ltd., a leading company in the semiconductor industry. His work has been instrumental in developing advanced semiconductor technologies that enhance device performance and reliability.

Collaborations

Futamura has collaborated with several talented individuals in his field, including Masahiko Nakamura and Yuto Nishiyama. These collaborations have fostered innovation and contributed to the success of their projects.

Conclusion

Yosui Futamura's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence the development of advanced semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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