The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2018
Filed:
Apr. 05, 2017
Applicant:
Rohm Co., Ltd., Kyoto, JP;
Inventors:
Motoharu Haga, Kyoto, JP;
Yosui Futamura, Kyoto, JP;
Assignee:
ROHM CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49548 (2013.01); H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49513 (2013.01); H01L 23/49575 (2013.01); H01L 23/49582 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/27462 (2013.01); H01L 2224/27472 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/73265 (2013.01);
Abstract
A semiconductor device includes a plurality of islands, each having an outer surface including an upper surface and end surfaces, semiconductor chips, above the respective islands, a bonding material, between the islands and the semiconductor chips, and plating layers, formed on the outer surfaces of the islands, and with at least one of the plurality of islands, the island is exposed as a bare surface region at a first end surface, which, among the end surfaces of the one island, faces the island adjacent thereto.