Yoshitaka Kyogoku

Title: Innovations by Yoshitaka Kyogoku

Introduction

Yoshitaka Kyogoku is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor devices, holding a total of 2 patents. His work focuses on enhancing the reliability and performance of wiring boards used in semiconductor applications.

Latest Patents

Kyogoku's latest patents include advancements in wiring boards and semiconductor devices. One of his notable inventions involves a package board that features multiple wiring layers and mounting pads arranged in a matrix. This design allows for solder bumps to connect to the mounting pads, facilitating the mounting of semiconductor chips. The uppermost wiring layer is crafted from a resin material with a Young's modulus of 1 GPa or lower at temperatures between 10 to 30°C, ensuring high elongation at break of 50% or more. Another patent focuses on an insulation material that enhances connection reliability during temperature cycles, incorporating reactive elastomers and epoxy resins.

Career Highlights

Yoshitaka Kyogoku is associated with NEC Corporation, where he has been instrumental in developing innovative semiconductor technologies. His expertise in materials science and engineering has led to breakthroughs that improve the performance and durability of electronic devices.

Collaborations

Kyogoku has collaborated with notable colleagues, including Masahiro Ishibashi and Yukihiro Kiuchi. Their combined efforts have contributed to advancements in semiconductor technology and the development of reliable wiring boards.

Conclusion

Yoshitaka Kyogoku's contributions to the field of semiconductor devices highlight his innovative spirit and dedication to enhancing technology. His patents reflect a commitment to improving the reliability and performance of electronic components, making a significant impact in the industry.