The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2011
Filed:
Apr. 10, 2007
Yukihiro Kiuchi, Minato-ku, JP;
Masahiro Ishibashi, Minato-ku, JP;
Yoshitaka Kyogoku, Minato-ku, JP;
Masatoshi Iji, Minato-ku, JP;
Yukihiro Kiuchi, Minato-ku, JP;
Masahiro Ishibashi, Minato-ku, JP;
Yoshitaka Kyogoku, Minato-ku, JP;
Masatoshi Iji, Minato-ku, JP;
NEC Corporation, Tokyo, JP;
Abstract
In a semiconductor device, the topmost wiring layer of the package board is formed from an insulation material in which the elongation at break is 20% or higher and Young's modulus is 1 GPa or less when the temperature is 10 to 30° C. This insulation material contains a reactive elastomer that reacts with epoxy resin or an epoxy resin curing agent; an epoxy resin; an epoxy resin curing agent; and a crosslinked styrene-butadiene rubber having a double bond and a hydroxyl group, a carboxylic group, or another polar group. It is therefore possible to provide a semiconductor device that has a wiring board in which the connection reliability in relation to temperature cycles is high and the adhesiveness between the insulation layer and the electroless copper plating layer is also high.