The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2011
Filed:
Apr. 15, 2005
Applicants:
Yukihiro Kiuchi, Tokyo, JP;
Masahiro Ishibashi, Tokyo, JP;
Yoshitaka Kyogoku, Tokyo, JP;
Inventors:
Assignee:
NEC Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
Abstract
In a semiconductor device (), a package board () is provided in which a plurality of wiring layers are layered, a plurality of mounting pads () arranged in a matrix are provided to the uppermost wiring layer of the package board (), and solder bumps () are connected to the mounting pads (). A semiconductor chip () is mounted on the package board () via the solder bumps (). The uppermost wiring layer of the package board () is formed from a resin material in which the Young's modulus is 1 GPa or lower when the temperature is 10 to 30° C., and the elongation at break is 50% or higher.