Yoshio Kurosawa

Title: Innovations by Yoshio Kurosawa in Copper Foil Manufacturing

Introduction

Yoshio Kurosawa is a notable inventor based in Kanagawa-ken, Japan. He has made significant contributions to the field of materials science, particularly in the manufacturing of rolled copper foil for flexible printed circuits. With a total of 2 patents to his name, his work has had a considerable impact on the electronics industry.

Latest Patents

Kurosawa's latest patents focus on advanced methods for producing rolled copper foil. One patent describes a method of manufacturing rolled copper foil that involves hot rolling an ingot, followed by alternating cold rolling and annealing processes. This method ensures that the annealed recrystallized grains have a mean grain diameter of no more than 20 µm, with a reduction ratio in the final cold rolling exceeding 90.0%. This innovative approach results in excellent flex fatigue properties and adequate softening properties.

Another patent details the composition and characteristics of the rolled copper foil itself. This foil contains specific percentages of silver and oxygen, along with minimal amounts of other elements. It boasts a thickness range of 5 to 50 µm and retains a tensile strength of at least 300 N/mm at 30°C. The foil's unique properties make it highly suitable for flexible printed circuits, enhancing their performance and reliability.

Career Highlights

Kurosawa is currently associated with Nippon Mining & Metals Co., Ltd., where he continues to develop innovative solutions in materials engineering. His expertise in copper foil manufacturing has positioned him as a key figure in the industry, contributing to advancements that benefit various electronic applications.

Collaborations

Kurosawa has worked alongside Takaaki Hatano, collaborating on projects that further enhance the capabilities of rolled copper foil. Their combined efforts have led to significant improvements in manufacturing processes and product quality.

Conclusion

Yoshio Kurosawa's contributions to the field of copper foil manufacturing exemplify the importance of innovation in materials science. His patents reflect a commitment to enhancing the performance of flexible printed circuits, making a lasting impact on the electronics industry.