The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6689235 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 10, 2004

Filed:

Dec. 04, 2001
Applicant:
Inventors:

Takaaki Hatano, Kanagawa-ken, JP;

Yoshio Kurosawa, Kanagawa-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22F 1/08 ; C22C 9/00 ;
U.S. Cl.
CPC ...
C22F 1/08 ; C22C 9/00 ;
Abstract

A method of manufacturing the rolled copper foil by a process which comprises hot rolling an ingot repeating cold rolling and annealing alternately, and finally cold rolling the work to a foil, the annealing immediately preceding the final cold rolling being performed under conditions that enable the annealed recrystallized grains to have a mean grain diameter of not greater than 20 &mgr;m, the reduction ration of the final cold rolling being beyond 90.0%, whereby excellent flex fatigue property and adequate softening property are achieved.


Find Patent Forward Citations

Hatano, Takaaki. (2004). Method of manufacturing rolled copper foil for flexible printed circuit (U.S. Patent No. 6689235). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6689235

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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