San Jose, CA, United States of America

Yoshinori Hiraoka


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Tochigi, JP (2019)
  • San Jose, CA (US) (2021 - 2022)

Company Filing History:


Years Active: 2019-2022

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3 patents (USPTO):Explore Patents

Title: Innovations by Yoshinori Hiraoka

Introduction

Yoshinori Hiraoka is a notable inventor based in San Jose, CA (US). He has made significant contributions to the field of soldering technology, holding a total of 3 patents. His work focuses on developing advanced flux compositions and soldering methods that enhance the efficiency and effectiveness of solder joints.

Latest Patents

Hiraoka's latest patents include innovative solutions such as a flux composition, solder paste, solder joint, and a solder joining method. The flux composition he developed is applicable without any film formation step, containing 20 wt % or more and 50 wt % or less of an epoxy resin, 15 wt % or more and 45 wt % or less of diallyl bisphenol A, and 1 wt % or more and 30 wt % or less of organic acid. Additionally, he has created a flux that includes a heat-resistant activator with low reactivity with thermosetting resins, which is used in a solder paste that combines solder powder and the flux.

Career Highlights

Yoshinori Hiraoka is currently employed at Senju Metal Industry Co., Ltd., where he continues to innovate in the field of soldering materials. His expertise and inventions have contributed to advancements in soldering technology, making processes more efficient and reliable.

Collaborations

Hiraoka has collaborated with notable coworkers such as Yasuhiro Kajikawa and Hiroyoshi Kawasaki. Their combined efforts have led to the development of cutting-edge technologies in the soldering industry.

Conclusion

Yoshinori Hiraoka's contributions to soldering technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the industry positively, paving the way for future innovations.

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