The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2019
Filed:
Sep. 15, 2016
Senju Metal Industry Co., Ltd., Tokyo, JP;
Yasuhiro Kajikawa, Tochigi, JP;
Yoshinori Hiraoka, Tochigi, JP;
Hiroyoshi Kawasaki, Tokyo, JP;
Takashi Hagiwara, Tochigi, JP;
Senju Metal Industry Co., Ltd., Tokyo, JP;
Abstract
Provided is a flux, flux residue of which keeps a predetermined viscosity during reflow and after a reflow step without hindering wettability of a solder alloy, the flux being compatible with an underfill in an underfill hardening step. The flux contains a thermosetting resin, a hardening agent, an organic acid and a solvent in which the flux contains 3% or more by mass to 8% or less by mass of the resin, 1% or more by mass to 5% or less by mass of the hardening agent to remain within a limit of an additive amount of the resin, 5% or more by mass to 15% or less by mass of the organic acid and a remainder of the solvent.