The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2022
Filed:
Aug. 01, 2019
Applicant:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Inventors:
Yasuhiro Kajikawa, Tochigi, JP;
Hiroyoshi Kawasaki, Tokyo, JP;
Hiroshi Sugii, Tochigi, JP;
Yoshinori Hiraoka, San Jose, CA (US);
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/00 (2006.01); B23K 35/36 (2006.01); B23K 35/02 (2006.01); B23K 35/362 (2006.01);
U.S. Cl.
CPC ...
B23K 35/3613 (2013.01); B23K 35/025 (2013.01); B23K 35/362 (2013.01);
Abstract
Provided are a flux composition that is applicable without any film formation step, and solder paste, a solder joint and a solder joining method using the flux composition. The flux composition contains 20 wt % or more and 50 wt % or less of an epoxy resin, 15 wt % or more and 45 wt % or less of diallyl bisphenol A, and 1 wt % or more and 30 wt % or less of organic acid.