Company Filing History:
2 out of 600 
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Years Active: 1992-2021
Title: The Innovative Contributions of Yoshinobu Nishimura in Grinding Technology
Introduction: Yoshinobu Nishimura, an accomplished inventor based in Tokyo, Japan, has made significant strides in the field of grinding technology. With a total of four patents to his name, he has played a vital role in enhancing the efficiency and precision of grinding machines, particularly those used for silicon wafer processing.
Latest Patents: Nishimura's latest innovations include a series of patents for advanced grinding equipment. One notable patent describes a double-head grinding machine featuring a disc-shaped carrier ring with a support hole designed for silicon wafers. This setup includes a rotation mechanism that allows the carrier ring to rotate around its center. The accompanying grinding wheel consists of a grinding stone specifically crafted for the effective grinding of silicon wafers. Another patent details a grinding apparatus that includes a spindle driving portion, capable of rotating a spindle to which a grinding wheel can be attached. This machine is recognized for its moving portion that facilitates the spindle's motion towards and away from the wafer, along with an inclination measuring portion that tracks changes in spindle inclination during operations.
Career Highlights: Throughout his career, Yoshinobu Nishimura has been associated with prominent companies, including Sumco Corporation, where he has contributed to advancements in semiconductor manufacturing technologies. His experience at Teraoka Seiko Co., Ltd. has further solidified his expertise in precision engineering and grinding solutions.
Collaborations: Nishimura's innovative journey has been supported by collaborations with talented professionals in his field. Notably, he has worked alongside Hiroshi Tanaka and Naoji Nakamura, both of whom have also made significant contributions to grinding technology. Their joint efforts exemplify the power of teamwork in achieving groundbreaking inventions.
Conclusion: Yoshinobu Nishimura's contributions to grinding technology through his inventive patents demonstrate his commitment to advancing the industry. His work not only improves the mechanics of grinding machines but also enhances the overall quality of silicon wafer processing. As a key figure in this field, Nishimura continues to influence future innovations that will shape the landscape of manufacturing technologies.