Sumco Corporation

Sumco Techxiv Corporation

Teraoka Seiko Co., Ltd.

Yoshinobu Nishimura

Hiroshi Tanaka

Naoji Nakamura

A double-head grinding machine includes a disc-shaped carrier ring having a support hole for supporting a silicon wafer, a rotation mechanism rotating the carrier ring around a center of the carrier ring, and a grinding wheel including a grinding stone for grinding the silicon wafer. The support hole is circular and has a center eccentric to the center of the carrier ring.

Carrier ring, grinding device, and grinding method

A double-head grinding machine includes: a spindle driving portion configured to rotate a spindle to which a grinding wheel is attachable; a moving portion configured to move the spindle driving portions toward and away from a wafer; and an inclination measuring portion configured to measure a change in an inclination of the spindle in association with a movement of the spindle driving portions.

Grinding apparatus and grinding method

A diffusion plate includes a plate member facing an opening end of a supply pipe with a thickness direction thereof substantially parallel with a supply direction of a supply fluid. The plate member is rotatable around a rotation axis substantially parallel with the thickness direction and has a diffusion hole, penetrating in the thickness direction at a position other than a rotation center of the plate member. The diffusion hole has a wall surface defined at a rear side in a rotation direction and has a first wall surface end defined in a facing surface facing the supply pipe, at a rearmost in the rotation direction and a second wall surface end defined in a non-facing surface at a rearmost in the rotation direction. The wall surface is inclined with the first wall surface end being at a front side of the second wall surface end in the rotation direction.

Scattering plate, grinding wheel, and grinding device

Disclosed herein is a load cell provided with a high-precision load-sensing member of ceramic on which are formed patterns of thin-film resistance for strain gages which are not subject to breakage and variation of resistance. The load cell comprises a bending beam of ceramic material and strain gages of thin-film resistance formed thereon, with the bending beam having a surface coated with amorphous glass on which are formed said strain gages of thin-film resistance. The strain gages are formed from an alloy composed of iron and one or more selected from chromium, cobalt, tungsten, molybdenum, niobium, and tantalum, and a small amount of impurities.

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Tokyo, Japan

Yoshinobu Nishimura