Company Filing History:
Years Active: 1996-1998
Title: Innovations of Yoshihiro Sakamoto
Introduction
Yoshihiro Sakamoto is a notable inventor based in Amagasaki, Japan. He has made significant contributions to the field of electroplating, with a focus on enhancing the reliability and efficiency of processes used in printed wiring boards. With a total of 2 patents to his name, Sakamoto's work is recognized for its innovative approaches to electroplating nonconductive surfaces.
Latest Patents
Sakamoto's latest patents include an electroplating process that involves applying specific carbon particles or a palladium compound to a surface comprising copper and an insulating material. This process microetches the copper to remove the specific carbon particles or the palladium compound, followed by electroplating. The method utilizes an aqueous solution containing 5 to 60 wt % of sulfuric acid, 3 to 35 wt % of hydrogen peroxide, and a phosphonic group-containing amine, ensuring highly reliable electroplating to the inner walls of printed wiring board through-holes. Another patent focuses on a process for directly electroplating a conductive metal to the inner walls of through-holes in printed wiring boards. This method involves applying an aqueous dispersion containing graphite or carbon black particles to a nonconductive surface substrate, followed by electroplating using the particle layer as a conductive layer.
Career Highlights
Yoshihiro Sakamoto is currently associated with Mec Company Ltd., where he continues to develop innovative solutions in the field of electroplating. His work has significantly impacted the manufacturing processes of printed wiring boards, contributing to advancements in the electronics industry.
Collaborations
Sakamoto has collaborated with notable coworkers, including Toshio Tanimura and Minoru Outani, who have contributed to his research and development efforts.
Conclusion
Yoshihiro Sakamoto's contributions to electroplating processes demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of materials and processes that enhance the reliability of electronic components.