The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 1996
Filed:
Mar. 15, 1995
Applicant:
Inventors:
Yoshihiro Sakamoto, Amagasaki, JP;
Toshio Tanimura, Amagasaki, JP;
Assignee:
MEC Co., Ltd., Amagasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D / ; C25D / ; C25D / ; C23C / ;
U.S. Cl.
CPC ...
205125 ; 205159 ; 205162 ; 205163 ; 205164 ; 205165 ; 205166 ; 205183 ; 205188 ;
Abstract
The invention relates to a process for directly electroplating a conductive metal to the inner walls of through-holes in printed-wiring boards. The process comprises steps of providing an aqueous dispersion containing graphite particles with an average particle diameter of 2 .mu.m or less or carbon black particles with an average particle diameter of 1 .mu.m or less; applying this aqueous dispersion to a surface of a nonconductive surface substrate; dipping the nonconductive surface in a strong acidic aqueous solution with pH 3 or lower to form a layer of said particles; and electroplating using the particle layer as a conductive layer.