The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 1998
Filed:
Aug. 20, 1996
MEC Co., Ltd., Amagasaki, JP;
Abstract
A process for electroplating a surface comprising copper and an insulating material, comprising: applying specific carbon particles or a palladium compound to this surface, microetching the copper to remove the specific carbon particles or the palladium compound, and providing electroplating. The process is characterized by using an aqueous solution comprising 5 to 60 wt % of sulfuric acid, 3 to 35 wt % of hydrogen peroxide, 0.01 to 10 wt % of a phosphonic group-containing amine or a salt thereof, and, optionally, 0.1 to 10 wt % of an amine other than the phosphonic group-containing amine, as a microetching agent. This process can ensure highly reliable electroplating to inner walls of printing wiring board through-holes.