Yoshihiro Inutsuka

Title: Innovations by Yoshihiro Inutsuka

Introduction

Yoshihiro Inutsuka is a notable inventor based in Kariya-city, Japan. He has made significant contributions to the field of semiconductor technology. His work has led to the development of innovative devices that enhance the performance and efficiency of electronic systems.

Latest Patents

Yoshihiro Inutsuka holds a patent for a semiconductor device and semiconductor module. This invention features a fan-out package structure that includes a semiconductor element with a first electrode pad and a second electrode pad on its front surface. The design incorporates a sealing material that covers the side surface of the semiconductor element, along with a redistribution layer that covers the front surface and part of the sealing material. The redistribution layer consists of an insulation layer, a first redistribution wire, and a second redistribution wire. Notably, the second redistribution wire is electrically connected to the second electrode pad and extends beyond the contour of the semiconductor element, ensuring electrical independence from the first redistribution wire. This innovative design enhances the functionality and reliability of semiconductor devices.

Career Highlights

Yoshihiro Inutsuka is currently associated with Denso Corporation, a leading global supplier of advanced automotive technology, systems, and components. His role at Denso has allowed him to apply his expertise in semiconductor technology to develop cutting-edge solutions for the automotive industry.

Conclusion

Yoshihiro Inutsuka's contributions to semiconductor technology exemplify the importance of innovation in enhancing electronic systems. His patent reflects a commitment to advancing the field and improving the performance of semiconductor devices.