The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Feb. 27, 2023
Denso Corporation, Kariya-city, JP;
Yoshihiro Inutsuka, Kariya-city, JP;
Takahiro Nakano, Kariya-city, JP;
Masayuki Takenaka, Kariya-city, JP;
Naohito Mizuno, Kariya-city, JP;
Seigo Osawa, Kariya-city, JP;
Yasushi Okura, Kariya-city, JP;
DENSO CORPORATION, Kariya-city, JP;
Abstract
An element package includes a semiconductor element, a redistribution layer, a sealing resin body, and an insulating portion. The semiconductor element includes a semiconductor substrate having an element region and a scribe region, a main electrode and a pad disposed on a surface of the semiconductor substrate, and a protective film disposed above the element region on the surface of the semiconductor substrate. The sealing resin body seals the semiconductor element while exposing the main electrode and the pad. The insulating portion is disposed above the scribe region on the surface of the semiconductor element with a height not to exceed an outer peripheral edge portion of an upper surface of the protective film on the element region. The redistribution layer extends over the protective film and the insulating portion above the scribe region.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile