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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12476163 B1

PDFFull Text
Date of Patent:
Nov. 18, 2025

Filed:

Oct. 12, 2022

Semiconductor device and semiconductor module

Applicant:

Denso Corporation, Kariya, JP;

Inventors:

Takahiro Nakano, Kariya, JP;

Seigo Oosawa, Kariya, JP;

Yasushi Ookura, Kariya, JP;

Naohito Mizuno, Kariya, JP;

Yoshihiro Inutsuka, Kariya, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:

Posz Law Group, PLC

Primary Examiner:

Marlon T Fletcher

Assistant Examiner:

Christina A Sylvia

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 21/4853 (2013.01); H01L 21/4871 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3121 (2013.01); H01L 23/5386 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/214 (2013.01);
Abstract

A semiconductor device includes a semiconductor element, a sealing member, and a rewiring layer. The rewiring layer includes an insulating layer covering a front surface of the semiconductor element and a part of the sealing member, an electrode connected to the semiconductor element, and an externally-exposed layer being conductive and covering a portion of the electrode exposed from the insulating layer.

Find Patent Forward Citations

Nakano, Takahiro. (2025). Semiconductor device and semiconductor module (U.S. Patent No. 12476163). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12476163

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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