Tokyo, Japan

Yoshihiko Miyakawa


Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2007-2008

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2 patents (USPTO):Explore Patents

Title: Innovations by Yoshihiko Miyakawa

Introduction

Yoshihiko Miyakawa is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of electronic part holding apparatuses and flexible board bonding methods. With a total of two patents to his name, his work showcases innovative solutions in technology.

Latest Patents

Miyakawa's latest patents include a "Method and apparatus for bonding flexible board" and a "Work piece holding apparatus, work piece illumination apparatus and work piece inspection system." The flexible board bonding method involves a unique process where a flexible board is bonded to a head holding member with a bent projection. This method utilizes a main suction head and a sub suction head to ensure precise bonding while maintaining the integrity of the flexible board. The second patent focuses on an electronic part holding apparatus designed for FPC bonding, which includes an illumination system for stable and uniform image detection.

Career Highlights

Miyakawa has established himself as a key figure at TDK Corporation, where he applies his expertise in developing advanced technologies. His innovative approaches have contributed to the company's reputation for excellence in electronic components.

Collaborations

Miyakawa has worked alongside talented colleagues such as Hidetoshi Suzuki and Akimasa Nakao. Their collaborative efforts have further enhanced the development of cutting-edge technologies within their field.

Conclusion

Yoshihiko Miyakawa's contributions to the field of electronics through his patents and collaborative work highlight his role as an influential inventor. His innovative methods continue to impact the industry positively.

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