Tdk Corporation

Yoshihiko Miyakawa

Hidetoshi Suzuki

Akimasa Nakao

Hiroshi Wakabayashi

Hitoshi Nakayama

A flexible board bonding method is a method in which a flexible board is bonded to a head holding member having a bent projection, provided with a load beam and a flexible member. The flexile board is sucked by a main suction head and a sub suction head positioned on the flexible board, and then the sub suction head is shifted in such a way that the sub suction head remains within an area defined by a rotation center located substantially at the main suction head and a rotation radius extending substantially between the main suction head and the sub suction head. Then, the flexible board is bonded to the head holding member at the main suction head side under the state in which the flexible board is kept away from said the bent projection by bending of the flexible board.

Method and apparatus for bonding flexible board

The present invention relates to an electronic part holding apparatus used for an FPC bonding apparatus or the like. An object of the present invention is to provide the structure including an illumination apparatus used for image detection that can illuminate a predetermined area stably and uniformly. To attain that object, in the holding apparatus having functions of holding and illuminating a work piece, the holding position and the illumination position are made different, and the deformation of the work piece is made possible at the illumination position.

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Tokyo, Japan

Yoshihiko Miyakawa