The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 08, 2008

Filed:

Apr. 27, 2004
Applicants:

Yoshihiko Miyakawa, Tokyo, JP;

Hidetoshi Suzuki, Tokyo, JP;

Akimasa Nakao, Tokyo, JP;

Inventors:

Yoshihiko Miyakawa, Tokyo, JP;

Hidetoshi Suzuki, Tokyo, JP;

Akimasa Nakao, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B65C 9/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A flexible board bonding method is a method in which a flexible board is bonded to a head holding member having a bent projection, provided with a load beam and a flexible member. The flexile board is sucked by a main suction head and a sub suction head positioned on the flexible board, and then the sub suction head is shifted in such a way that the sub suction head remains within an area defined by a rotation center located substantially at the main suction head and a rotation radius extending substantially between the main suction head and the sub suction head. Then, the flexible board is bonded to the head holding member at the main suction head side under the state in which the flexible board is kept away from said the bent projection by bending of the flexible board.


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