Yoshiharu Harada

Title: Yoshiharu Harada: Semiconductor Packaging and Thermal Management Innovations.

Introduction

Yoshiharu Harada is an inventor based in Okazaki, Japan, whose work includes innovations in semiconductor packaging and heat management. He is associated with Denso Corporation and is credited with 2 patents.

Latest Patents

Harada’s listed patents address circuit-board construction and heat dissipation in semiconductor devices.

“Circuit board with built-in semiconductor chip and method of manufacturing the same” describes a circuit board with a semiconductor chip encapsulated in a thermoplastic resin portion of an insulating member. A wiring member connects electrodes on opposite sides of the chip through pads, interlayer connections, and connection portions. The design uses diffusion layers at specified electrical interfaces and combines materials with different melting points to support the board’s construction.

“Semiconductor device having heat radiating member” describes a device containing a printed circuit board, a ceramic substrate with a mounted semiconductor element, and a fin within a case. Protrusions on the fin’s contact face touch the case when the fin is fixed in place, providing a path for heat to pass from the ceramic substrate and dissipate through the fin and case.

Career Highlights

Harada’s listed inventions focus on practical semiconductor-device engineering. One addresses the integration and electrical connection of a chip within a circuit board, while the other focuses on transferring heat from a semiconductor element to a device’s fin and case.

Collaborations

Harada’s listed coworkers include Kan Kinouchi and Mitsuhiro Saito. His work is associated with Denso Corporation.

Conclusion

Yoshiharu Harada’s two listed patents reflect contributions to semiconductor packaging and thermal management, with designs aimed at integrating chips into circuit boards and improving heat dissipation.